Reducing the metal-graphene contact resistance through laser-induced defects
Authors: Vikas Jangra, Satender Kataria, Max C. Lemme
AI-generated Key Points
- Graphene's exceptional properties make it promising for electronic and optoelectronic applications
- High contact resistance between metal and graphene is a challenge for efficient charge carrier injection
- Laser irradiation method proposed by Vikas Jangra, Satender Kataria, and Max C. Lemme aims to reduce specific contact resistance in nickel-contacted devices
- Laser with a wavelength of λ = 532 nm used to induce defects at contact regions of graphene, monitored using micro-Raman spectroscopy
- Significant reduction in contact resistance observed in laser-treated devices, with reduction scaling with laser power
- Lowest contact resistance achieved was approximately 250 Ωμm for devices treated with 20 mW laser power compared to 900 Ωμm for untreated devices
- Reduction in contact resistance attributed to increase in defect density induced by laser treatment, facilitating enhanced charge carrier injection from metal into graphene
- Laser irradiation shown as scalable technology for reducing contact resistance in graphene-based devices, potentially applicable to other two-dimensional materials
Abstract: Graphene has been extensively studied for a variety of electronic and optoelectronic applications. The reported contact resistance between metal and graphene, or rather its specific contact resistance (R{_C}), ranges from a few tens of {\Omega} {\mu}m up to a few k{\Omega} {\mu}m. Manufacturable solutions for defining ohmic contacts to graphene remain a subject of research. Here, we report a scalable method based on laser irradiation of graphene to reduce the R{_C} in nickel-contacted devices. A laser with a wavelength of {\lambda} = 532 nm is used to induce defects at the contact regions, which are monitored \textit{in-situ} using micro-Raman spectroscopy. Physical damage is observed using \textit{ex-situ} atomic force and scanning electron microscopy. The transfer line method (TLM) is used to extract R{_C} from back-gated graphene devices with and without laser treatment under ambient and vacuum conditions. A significant reduction in R{_C} is observed in devices where the contacts are laser irradiated, which scales with the laser power. The lowest R{_C} of about 250 {\Omega} {\mu}m is obtained for the devices irradiated with a laser power of 20 mW, compared to 900 {\Omega} {\mu}m for the untreated devices. The reduction is attributed to an increase in defect density, which leads to the formation of crystallite edges and in-plane dangling bonds that enhance the injection of charge carriers from the metal into the graphene. Our work suggests laser irradiation as a scalable technology for R{_C} reduction in graphene and potentially other two-dimensional materials.
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