Reducing the metal-graphene contact resistance through laser-induced defects

AI-generated keywords: Graphene Electronic applications Optoelectronic applications Contact resistance Laser irradiation

AI-generated Key Points

The license of the paper does not allow us to build upon its content and the key points are generated using the paper metadata rather than the full article.

  • Graphene's exceptional properties make it promising for electronic and optoelectronic applications
  • High contact resistance between metal and graphene is a challenge for efficient charge carrier injection
  • Laser irradiation method proposed by Vikas Jangra, Satender Kataria, and Max C. Lemme aims to reduce specific contact resistance in nickel-contacted devices
  • Laser with a wavelength of λ = 532 nm used to induce defects at contact regions of graphene, monitored using micro-Raman spectroscopy
  • Significant reduction in contact resistance observed in laser-treated devices, with reduction scaling with laser power
  • Lowest contact resistance achieved was approximately 250 Ωμm for devices treated with 20 mW laser power compared to 900 Ωμm for untreated devices
  • Reduction in contact resistance attributed to increase in defect density induced by laser treatment, facilitating enhanced charge carrier injection from metal into graphene
  • Laser irradiation shown as scalable technology for reducing contact resistance in graphene-based devices, potentially applicable to other two-dimensional materials
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Authors: Vikas Jangra, Satender Kataria, Max C. Lemme

arXiv: 2402.07151v1 - DOI (physics.app-ph)
30 pages

Abstract: Graphene has been extensively studied for a variety of electronic and optoelectronic applications. The reported contact resistance between metal and graphene, or rather its specific contact resistance (R{_C}), ranges from a few tens of {\Omega} {\mu}m up to a few k{\Omega} {\mu}m. Manufacturable solutions for defining ohmic contacts to graphene remain a subject of research. Here, we report a scalable method based on laser irradiation of graphene to reduce the R{_C} in nickel-contacted devices. A laser with a wavelength of {\lambda} = 532 nm is used to induce defects at the contact regions, which are monitored \textit{in-situ} using micro-Raman spectroscopy. Physical damage is observed using \textit{ex-situ} atomic force and scanning electron microscopy. The transfer line method (TLM) is used to extract R{_C} from back-gated graphene devices with and without laser treatment under ambient and vacuum conditions. A significant reduction in R{_C} is observed in devices where the contacts are laser irradiated, which scales with the laser power. The lowest R{_C} of about 250 {\Omega} {\mu}m is obtained for the devices irradiated with a laser power of 20 mW, compared to 900 {\Omega} {\mu}m for the untreated devices. The reduction is attributed to an increase in defect density, which leads to the formation of crystallite edges and in-plane dangling bonds that enhance the injection of charge carriers from the metal into the graphene. Our work suggests laser irradiation as a scalable technology for R{_C} reduction in graphene and potentially other two-dimensional materials.

Submitted to arXiv on 11 Feb. 2024

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Results of the summarizing process for the arXiv paper: 2402.07151v1

This paper's license doesn't allow us to build upon its content and the summarizing process is here made with the paper's metadata rather than the article.

Graphene has emerged as a promising material for various electronic and optoelectronic applications due to its exceptional properties. One of the challenges in utilizing graphene for these applications is the high contact resistance between metal and graphene, which can hinder efficient charge carrier injection. In this study by Vikas Jangra, Satender Kataria, and Max C. Lemme, a scalable method based on laser irradiation of graphene is proposed to reduce the specific contact resistance (R{_C}) in nickel-contacted devices. The researchers utilized a laser with a wavelength of {\lambda} = 532 nm to induce defects at the contact regions of graphene, which were monitored in real-time using micro-Raman spectroscopy. Physical damage at the contact sites was further analyzed through ex-situ atomic force and scanning electron microscopy. The transfer line method (TLM) was employed to extract R{_C} from back-gated graphene devices with and without laser treatment under both ambient and vacuum conditions. Significant reduction in R{_C} was observed in devices where the contacts were laser irradiated, with the reduction scaling with the laser power used. The lowest R{_C} achieved was approximately 250 {\Omega} {\mu}m for devices treated with a laser power of 20 mW, compared to 900 {\Omega} {\mu}m for untreated devices. This decrease in contact resistance was attributed to an increase in defect density induced by the laser treatment, leading to the formation of crystallite edges and in-plane dangling bonds that facilitated enhanced charge carrier injection from the metal into the graphene. Overall, this study highlights the potential of laser irradiation as a scalable technology for reducing contact resistance in graphene-based devices. It offers insights that could be applicable to other two-dimensional materials as well. By addressing this critical issue of contact resistance, this research contributes towards advancing the practical implementation of graphene in electronic and optoelectronic applications.
Created on 11 Jun. 2024

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