AI-generated Key Points
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- Michael Filler and Benjamin Reinhardt propose a new process for fabricating microelectronics
- The process involves synthesizing modular, nanometer-scale components and suspending them in a liquid "ink" for storage or transport
- A 3D-printer-like machine is used to create circuits by placing and wiring the components
- Recent developments in nanotechnology, colloidal chemistry, precision additive manufacturing, and computer vision have made this approach possible
- The authors describe a roadmap to these nanomodular electronics that could enable a "fab in a box"
- This new process has the potential to significantly reduce production costs and increase efficiency while also allowing for greater customization of electronic devices.
Authors: Michael Filler, Benjamin Reinhardt
Abstract: It may be possible to reinvent how microelectronics are made using a two step process: (1) Synthesizing modular, nanometer-scale components -- transistors, sensors, and other devices -- and suspending them in a liquid "ink" for storage or transport; (2) Using a 3D-printer-like machine to create circuits by placing and wiring the components. Developments in nanotechnology, colloidal chemistry, precision additive manufacturing, and computer vision suggest this new process is possible. Herein, we describe a roadmap to these nanomodular electronics, which could enable a "fab in a box" and make fabricating microelectronics as straightforward as printing this document.
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