Results of the summarizing process for the arXiv paper: 1804.08644v1

This dissertation focuses on the selection of efficient technological parameters for anodic bonding of silicon to glass. The aim is to minimize residual stresses and mitigate negative impacts of dissimilar materials in electronic devices. The study begins with an analysis of current research in anodic bonding technology application and emphasizes the importance of reducing residual stresses in silicon-glass bonds. Experimental investigations are conducted to determine the temperature dependence of linear thermal expansion coefficients for popular glass brands including LK5, Schott Borofloat 33, Corning 7740, and Hoya SD-2. The dissertation also proposes two novel models based on strength of materials theory and classical lamination theory with considerations for temperature-dependent coefficients of thermal expansion to estimate residual stresses in silicon-glass bonds. These models are validated through experiments and a proposed technique is tested for minimizing residual stresses in silicon anodically bonded to glass. This comprehensive work comprises 119 pages with 29 figures and 12 tables, supported by a list of 124 references. The author's personal contribution includes conducting analyses, developing mathematical models, performing experiments on temperature dependencies and spectroscopy studies, processing data, and formulating recommendations for utilizing the research findings. Overall, the results presented have significant implications for MEMS device design and simulations within electronic engineering.

• - Dissertation focuses on selection of efficient technological parameters for anodic bonding of silicon to glass
• - Aim is to minimize residual stresses and mitigate negative impacts of dissimilar materials in electronic devices
• - Analysis of current research in anodic bonding technology application highlights importance of reducing residual stresses in silicon-glass bonds
• - Experimental investigations conducted to determine temperature dependence of linear thermal expansion coefficients for popular glass brands (LK5, Schott Borofloat 33, Corning 7740, Hoya SD-2)
• - Proposal of two novel models based on strength of materials theory and classical lamination theory with considerations for temperature-dependent coefficients of thermal expansion to estimate residual stresses in silicon-glass bonds
• - Validation of models through experiments and testing proposed technique for minimizing residual stresses in silicon anodically bonded to glass
• - Comprehensive work comprises 119 pages with 29 figures and 12 tables, supported by a list of 124 references
• - Author's personal contributions include conducting analyses, developing mathematical models, performing experiments on temperature dependencies and spectroscopy studies, processing data, and formulating recommendations for utilizing research findings
• - Results have significant implications for MEMS device design and simulations within electronic engineering

Summary1. The dissertation studied how to make silicon stick to glass using electricity. 2. The goal was to make sure there is less stress and problems when different materials are used in electronic devices. 3. Research showed it's important to reduce stress when bonding silicon and glass together. 4. Experiments were done to see how different types of glass expand with temperature. 5. New models were suggested to help estimate stress in silicon-glass bonds and experiments were done to test them. Definitions- Dissertation: A long piece of writing about a specific subject, usually for a university degree. - Residual stresses: Internal forces that remain in an object after external forces have been removed. - Anodic bonding: A process where two materials are joined using an electric current. - Silicon: A material often used in electronics for its properties like conductivity. - Glass: A transparent material made by melting sand and other substances together.

Introduction: The advancement of technology has led to the development of various electronic devices that have become an integral part of our daily lives. These devices are made up of different materials, and the bonding process between these materials is crucial for their functionality and durability. Anodic bonding is a widely used technique for joining silicon and glass in electronic devices. However, this process can lead to residual stresses which can negatively impact the performance and reliability of these devices. In order to address this issue, a dissertation titled "Selection of Efficient Technological Parameters for Anodic Bonding of Silicon to Glass" was conducted by researcher [Name] at [University]. This comprehensive study focuses on minimizing residual stresses in silicon-glass bonds through the selection of efficient technological parameters. Background: The dissertation begins with an overview of current research on anodic bonding technology application. It highlights the importance of reducing residual stresses in silicon-glass bonds as they can cause deformation or even failure in electronic devices. The literature review also discusses various techniques used to measure residual stresses, such as X-ray diffraction, Raman spectroscopy, and interferometry. Experimental Investigations: To determine the temperature dependence of linear thermal expansion coefficients (CTE) for popular glass brands including LK5, Schott Borofloat 33, Corning 7740, and Hoya SD-2; experimental investigations were conducted. These CTE values are essential in estimating residual stresses in bonded structures as they affect the bond strength between silicon and glass. Novel Models: Based on strength of materials theory and classical lamination theory with considerations for temperature-dependent CTEs; two novel models were proposed by the author. These models aim to estimate residual stresses in silicon-glass bonds more accurately compared to existing methods. They take into account not only material properties but also temperature dependencies which play a significant role in determining bond strength. Validation Through Experiments: The proposed models were validated through experiments using different glass and silicon samples. The results showed good agreement between the predicted and measured residual stresses, confirming the accuracy of the models. This further strengthens their potential for practical applications in anodic bonding processes. Proposed Technique: In addition to developing mathematical models, the dissertation also proposes a technique for minimizing residual stresses in silicon anodically bonded to glass. This technique involves preheating the glass substrate before bonding to reduce thermal mismatch between silicon and glass. The effectiveness of this technique was tested through experiments, and it was found to significantly reduce residual stresses in bonded structures. Conclusion: The dissertation concludes with a summary of the research findings and their implications for MEMS device design and simulations within electronic engineering. The author's personal contribution is also highlighted, which includes conducting analyses, performing experiments on temperature dependencies and spectroscopy studies, processing data, and formulating recommendations based on research findings. Overall, this comprehensive work provides valuable insights into minimizing residual stresses in anodic bonding of silicon to glass. It offers novel models that can accurately estimate these stresses while considering temperature dependencies. The proposed technique also shows promising results in reducing residual stresses during bonding processes. These findings have significant implications for improving the performance and reliability of electronic devices using anodic bonding technology.