# Calculation and selection of silicon to glass anodic bonding modes based on the criterion of minimum residual stress

**Authors:** Leonid S. Sinev  
**arXiv:** [1804.08644](https://arxiv.org/abs/1804.08644)  
**Date:** 2018-04-23  
**Summary page:** https://www.summarizepaper.com/en/paper/1804.08644v1/

## Key points

- Dissertation focuses on selection of efficient technological parameters for anodic bonding of silicon to glass
- Aim is to minimize residual stresses and mitigate negative impacts of dissimilar materials in electronic devices
- Analysis of current research in anodic bonding technology application highlights importance of reducing residual stresses in silicon-glass bonds
- Experimental investigations conducted to determine temperature dependence of linear thermal expansion coefficients for popular glass brands (LK5, Schott Borofloat 33, Corning 7740, Hoya SD-2)
- Proposal of two novel models based on strength of materials theory and classical lamination theory with considerations for temperature-dependent coefficients of thermal expansion to estimate residual stresses in silicon-glass bonds
- Validation of models through experiments and testing proposed technique for minimizing residual stresses in silicon anodically bonded to glass
- Comprehensive work comprises 119 pages with 29 figures and 12 tables, supported by a list of 124 references
- Author's personal contributions include conducting analyses, developing mathematical models, performing experiments on temperature dependencies and spectroscopy studies, processing data, and formulating recommendations for utilizing research findings
- Results have significant implications for MEMS device design and simulations within electronic engineering

## Summary

This dissertation focuses on the selection of efficient technological parameters for anodic bonding of silicon to glass. The aim is to minimize residual stresses and mitigate negative impacts of dissimilar materials in electronic devices. The study begins with an analysis of current research in anodic bonding technology application and emphasizes the importance of reducing residual stresses in silicon-glass bonds. Experimental investigations are conducted to determine the temperature dependence of linear thermal expansion coefficients for popular glass brands including LK5, Schott Borofloat 33, Corning 7740, and Hoya SD-2. The dissertation also proposes two novel models based on strength of materials theory and classical lamination theory with considerations for temperature-dependent coefficients of thermal expansion to estimate residual stresses in silicon-glass bonds. These models are validated through experiments and a proposed technique is tested for minimizing residual stresses in silicon anodically bonded to glass. This comprehensive work comprises 119 pages with 29 figures and 12 tables, supported by a list of 124 references. The author's personal contribution includes conducting analyses, developing mathematical models, performing experiments on temperature dependencies and spectroscopy studies, processing data, and formulating recommendations for utilizing the research findings. Overall, the results presented have significant implications for MEMS device design and simulations within electronic engineering.